Chenglong (Jackie) Wang is an undergraduate student in Mechanical Engineering at Zhejiang University and a visiting student researcher in the Department of Mechanical Engineering at the University of Wisconsin–Madison. His research interests lie at the intersection of advanced manufacturing, soft matter, and bio-related applications, with a focus on multiphysics simulation in additive manufacturing, emerging 3D printing technologies, and functional polymer materials.

At Zhejiang University, he has worked on melt electrowriting (MEW), high-resolution structure fabrication, and scaffold design, emphasizing process stability, multiscale structural control, and coupled multiphysics during printing. At the University of Wisconsin–Madison, his work extends to ultrasound- and field-assisted additive manufacturing and DLP-based 3D printing of intelligent material systems, studying how acoustic, optical, and thermal fields influence curing behavior to achieve higher precision and functionality in three-dimensional architectures.

Chenglong grew up in Linyi, a city in Shandong, eastern China, where an early curiosity about how things are designed and made led him toward mechanical engineering and 3D printing. He views research as the disciplined process of turning questions into testable hypotheses and models into experimentally verifiable structures and data. Outside the lab, he enjoys traveling and learning languages; he speaks Chinese, English, and German, and is currently learning Spanish. His background continues to shape his belief that the value of research ultimately lies in its potential to contribute, even incrementally, to improving real-world outcomes.